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Categories | PCB Assembly Services |
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Brand Name: | Linked Electronics |
Model Number: | LPCB1320 |
Certification: | UL, TS16949, ISO14001, ISO9001 |
Place of Origin: | China |
MOQ: | 1pcs |
Price: | by negotiation |
Payment Terms: | T/T, Western Union,Paypal |
Supply Ability: | 10, 000pcs per month |
Delivery Time: | 4 weeks |
Packaging Details: | vacumm package+carton box |
Product Name: | PCBA Board |
Packing: | ESD package+Carton |
MOQ: | 1 Piece |
Testing Service: | AOI , Xray, and Function Test |
Surfade Treatment: | ENIG Rohs |
Quick Turn: | YES, 5 Working days |
Material: | FR4 Rigid PCB |
Brand: | Linked Electronics |
Company Info. |
Linked Electronics Co., Limited |
View Contact Details |
Product List |
FR4 Prototype PCB Board Customized SMT/DIP Services Components Sourcing
Linked Electronics Fast One-stop SMT DIP Customize PCB Assembly Service With ISO9001 ISO14001 TS16949
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1).1-32Layers PCB Fabrication
File Needed: Gerber file or other PCB files.
2).Components sourcing
Needed: BOM list included detailed Part number and Designator.
3).PCB components parts assembly
The above of PCB files, BOM lists, and pick place file, etc.
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Why Choose Linked Electronics and Our Advantages.
1.Certifications: ROHS,UL, ISO9001; ISO14001;TS16949
2.Number Of Layers:1-32Layers(Rigid); 1-10Layers(Rigid-Flex)
3.PCBA Workshop:4SMT Lines,2 DIP Lines.
4.Number of Workers: Over 400
5.Quality Guarantee: PCBA with 2 years warranty
6.Component Sourcing: Geniune parts from mouser, digikey, future etc
7. Flexible payment method: Paypal, TT, Western Union, Visa, Master and American Express.
Product Discription
Product Name | PCB prototype SMT/DIP Servces |
Material | FR4 |
Layer Count | 4 layer |
Spec | 1.6MM, 1OZ, Green Soldermask, White Legend, HASL Rohs |
Lead Time | 20 Working Days |
Features
1) Professional Surface-mounting and Through-hole soldering
2) UV Conformal Coating
3) PCB Assembly With UL,CE,FCC,Rohs Approval
4) SMT 1206,0805,0603,0402,0201parts
5) Nitrogen gas reflow soldering technology
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
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