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XCVE1752-1LLINSVG1369

Categories Integrated Circuits
Category: Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status: Active
Peripherals: DDR, DMA, PCIe
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Series: Versal™ AI Core
Package: Tray
Mfr: AMD
Supplier Device Package: 1369-BGA (35x35)
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature: -40°C ~ 100°C (TJ)
Architecture: MPU, FPGA
Package / Case: 1369-BFBGA
Number of I/O: 500
RAM Size: -
Speed: 400MHz, 1GHz
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
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XCVE1752-1LLINSVG1369

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 1369-BGA (35x35)
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